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cebook Technical Articles covering Active and Passive RF Component design support for the RF Design Engineer as well as Power Conversion design support topics.

Active Component Articles

LNA Operation over BB Applications
WanTcom provides exceptional LNA operation over broad bandwidths by performing the device matching at the semiconductor die level, not outside the package, which adds packaging parasitics that destroy your circuit match.    Read More>>
Understanding TCC of RF MLC Chip Caps
Temperature Coefficient of Capacitance (TCC) of SMT MLC devices are used to offset temperature performance of competing components in the circuit.  Read More>>
RF Gain Stage temperature compensation
Yantel Temp Comp Chip Attenuators improve reliability through component reduction and self-limiting current consumption in small signal applications.      Read More>>
Current rating curves of MLC RF Chip Caps
Information and methods for arriving at RF current ratings of MLC show that the general shape of the current rating curves can be established for a variety of Ceramic Dielectric Properties.    Read More>>
Passive Component Articles
Building an accurate RF MLC Mmodel
It is always a good idea to know and understand the measurement setup and testing techniques employed to acquire the exacting test data used to build simulation models.     Read More>>
RF Power Amplifiers operate cooler
Improving system level reliability through the use of ATC Ultra-Low ESR Ceramic RF Capacitors used in matching networks for your amplifiers.   Read More>>
Long term Aging, find your epsilon
Capacitor Aging describes an effect exhibited by ferroelectric class dielectric materials in which barium titanate (BaTiO3) is the main constituent. Dielectric permittivity decay, epsilon (ε), is noted over time with these formulations. Read More>>
Lowest possible circuit costs achieved
Practical RF Capacitor Tolerance Selection for Coupling, DC Blocking and Bypass applications are critical. Read More>>
High Q RF Caps in Matching Applications
Next to the output transistor operating in most class A or AB approaches, the Shunt C position is the biggest heat generator in the power amplifier circuit, so give it the attention that it needs to optimize and minimize thermal rise. Read More>>
Careful analysis of dependent properties
In RF Caps during the selection process will result in optimized circuit performance of broadband circuits. Read More>>
Mechanical pressure can kill your RF Cap
The Greek root of the word piezo means "to press". In 1880, Jacques and Pierre Curie discovered that pressure applied to a quartz crystal creates an electrical potential on the crystal. Likewise, they also discovered that an electrical potential impressed on the crystal creates. Read More>>
Calc. effective capacitance vs frequency
Impedance matching applications where minimum temperature drift is critical, this approach will save you time & money during development.  Read More>>
Calculations for RF Coax Designs
Calculate the Impedance, Phase, Capacitance, Delay, Velocity of Propagation & Attenuation of a coax design. Read More>>
Thermal MGMT in RF Power Amps
A few quick calculations of the dissipated power in the RF Capacitor is critical, so knowing the ESR and matching impedances are key to achieving trouble free operation in RF Power Amp circuits. Read More>>
Power Conversion Articles
Thermal Considerations for RF Resistors
Substrate material changes due to health concerns lead to in-depth research on how to make thermal measurements. The elimination of BeO from RF Resistive products resulted in a materials analysis before you can be assured of a reliable design in your RF Couplers or RF Ferrite Circulator/Isolator applications. Read More>>
Contact Gary for a listing of items. His 20 years of design experience of magnetics and SMPS circuits can get you on the right track without wasting your valuable time.
The single most important parameter
Equivalent Series Resistance (ESR) is the most important parameter in selecting an RF Cap to fit the application. It is the summation of all losses resulting.      Read More>>
RF Cap Mechanical Placement Orientation
Many RF Chip Caps are typically surface mounted on a microstrip. Mounting can be with the electrodes parallel or perpendicular to the microstrip.  Read More>>